皇冠hga035新版|首页_welcome!

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We have advanced quality control system in the industry. The laboratory space of the headquarters shall be reasonably divided and tested in different regions, so as to provide efficient information-based support and physical environment; Set up safety monitoring and record the whole process of detection operation; Equipped with precise instruments and equipment to create a safe and efficient closed laboratory environment. All imcoming components will be classified and tested as following SETP 1 to STEP 6 to maych Power-V Quality Assurance Plan.


STEP 1 External Visual Inspection

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Appearance inspection refers to a series of comparative inspection of sample packaging, label, tape braiding, plastic packaging texture, silk screen printing,pin process, size, oxidation degree, etc. by engineers according to therequirements of standard process. take photos of the goods label and outer package as required. After uploading the label picture through the system, the engineer uses a high-power microscope to retrieve the original label data in the background of the system, and judge whether the sample label is consistent with the original label by comparison.


STEP 2 X-RAY Non-destructive Flaw Inspection

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STEP 3   Component Decap Test

Detect the delamination defect of the internal structure of the chip,or the position where the chip cannot be directly detected by appearance,the change of light intensity is different after X-ray penetrates different density substances. The contrast effect can form an image to show the internal structure of the object to be tested, so as to make the internal defects of the chip have nowhere to hide without damaging the sample to be tested.

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Opening the chip with chemicals can expose the internal structure of the chip, so as to directly observe the authenticity of the wafer manufacturer in the chip or provide visual detection and judgment for failure cause analysis.

STEP 4  Burn-in Test

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To simulate the reliability of materials under different temperature environments, it is necessary to cooperate with external performance testing equipment to test the performance and reliability of materials under different extreme conditions

STEP 5  Solderability Test


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In the assembly and welding process of electronic products, the welding quality directly affects the quality of the whole machine. Therefore, in order to improve the welding quality, in addition to strictly controlling the process parameters, it is also necessary to carry out scientific solderability test on printed circuit boards and electronic components.

 

STEP 6  Electrical function Test 

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Test whether the key performance of the material meets the standard according to the original specification. Use the semiconductor tube characteristic grapher to check whether the chip is damaged through open circuit and short circuit test.